By Steven H. Voldman
With the evolution of semiconductor expertise and worldwide diversification of the semiconductor company, trying out of semiconductor units to platforms for electrostatic discharge (ESD) and electric overstress (EOS) has elevated in importance.
ESD checking out: From parts to Systems updates the reader within the new checks, try versions, and methods within the characterization of semiconductor elements for ESD, EOS, and latchup.
- Provides figuring out and information of ESD versions and standards together with human physique version (HBM), laptop version (MM), charged equipment version (CDM), charged board version (CBM), cable discharge occasions (CDE), human steel version (HMM), IEC 61000-4-2 and IEC 61000-4-5.
- Discusses new trying out methodologies reminiscent of transmission line pulse (TLP), to very quick transmission line pulse (VF-TLP), and destiny tools of lengthy pulse TLP, to ultra-fast TLP (UF-TLP).
- Describes either traditional trying out and new checking out recommendations for either chip and process point evaluation.
- Addresses EOS checking out, electromagnetic compatibility (EMC) scanning, to present reconstruction methods.
- Discusses latchup characterization and checking out methodologies for review of semiconductor expertise to product testing.
ESD trying out: From parts to Systems is a part of the authors’ sequence of books on electrostatic discharge (ESD) security; this e-book could be a useful reference for the pro semiconductor chip and system-level ESD and EOS attempt engineer. Semiconductor gadget and procedure improvement, circuit designers, caliber, reliability and failure research engineers also will locate it a necessary reference. additionally, its educational therapy will entice either senior and graduate scholars with pursuits in semiconductor strategy, gadget physics, semiconductor checking out and experimental work.
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Extra resources for ESD Testing: From Components to Systems
ESD Testing: From Components to Systems by Steven H. Voldman